ver: 0.8 nov 22, 2011 tel: 886-3-5788833 http://www.gmt.com.tw 1 G2997B global mixed-mode technology ddr termination regulator features ? support ddr i (1.25vtt), ddr ii (0.9 vtt), ddr iii (0.75 vtt), and ddr iiil (0.675vtt) requirements ? input voltage range: 3v to 5.5v ? vldoin voltage range: 1.2v to 3.6v ? requires only 20 f ceramic output capaci- tance ? supports high-z in s3 and soft-off in s5 ? integrated divider tracks 1/2 vddqsns for both vtt and vttref ? remote sensing (vttsns) ? 20mv accuracy for vtt and vttref ? 10ma buffered reference (vttref) ? built-in soft-start ? over current protection ? thermal shutdown protection ? msop-10 & msop-10 (fd) package applications ? ddr i/ii/iii/iiil memory termination ? sstl ? 2, sstl ? 18 ? hstl termination general description the G2997B is a 2a sink/source tracking termination regulator. it is specifically designed for low-cost/ low-external component count systems. the G2997B maintains a high speed operational amplifier that pro- vides fast load transient response and only requires 20 f (2x10 f) of ceramic output capacitance. the G2997B supports remote sensing functions and all features required to power the ddr i / ddr ii /ddriii /ddr iiil vtt bus termination according to the jedec specification. in addition, the G2997B includes integrated sleep-state controls placing vtt in high-z in s3 (suspend to ram) and soft-off for vtt and vttref in s5 (shutdown). the G2997B is available in msop-10 and msop-10 (fd). ordering information order number marking temp. range package (green) G2997Bp71u g 2997 -40 c~85 c msop-10 G2997Bf61u g 2997b -40 c~85 c msop-10 (fd) note: p7: msop-10 f6: msop-10 (fd) 1: bonding code u: tape & reel pin configuration ddr ii * recommended v in =3.3v ddr i typical application circuit s5 1 2 3 4 5 vddqsns vldoin pgnd vttsns vtt 10 9 8 7 6 gnd s3 vin msop-10 vttref G2997B vddqsns vin vldoin vtt gnd pgnd s3 s5 vin=5v 2x10 f vttsns vttref s5 2.5v s3 0.1 f c2 c1 r s5 r s3 10k 10k ddr ii vddqsns vin vldoin vtt gnd pgnd s3 s5 vin=5v 2x10 f vttsns vttref s5 1.8v s3 0.1 f c2 c1 r s5 r s3 10k 10k ddr ii ddr iii* vddqsns vin vldoin vtt gnd pgnd s3 s5 vin=3.3v 2x10 f vttsns vttref s5 1.5v s3 0.1 f c2 c1 r s5 r s3 10k 10k note: recommend connecting the thermal pad to the gnd for excellent power dissipation. s5 1 2 3 4 5 vddqsns vldoin pgnd vttsns vtt 10 9 8 7 6 gnd s3 vin msop-10 (fd) vttref G2997B top view thermal pad ddr ii * recommended v in =3.3v ddr i typical application circuit s5 1 2 3 4 5 vddqsns vldoin pgnd vttsns vtt 10 9 8 7 6 gnd s3 vin msop-10 vttref G2997B s5 1 2 3 4 5 vddqsns vldoin pgnd vttsns vtt 10 9 8 7 6 gnd s3 vin msop-10 vttref G2997B vddqsns vin vldoin vtt gnd pgnd s3 s5 vin=5v 2x10 f vttsns vttref s5 2.5v s3 0.1 f c2 c1 r s5 r s3 10k 10k ddr ii vddqsns vin vldoin vtt gnd pgnd s3 s5 vin=5v 2x10 f vttsns vttref s5 1.8v s3 0.1 f c2 c1 r s5 r s3 10k 10k ddr ii ddr iii* vddqsns vin vldoin vtt gnd pgnd s3 s5 vin=3.3v 2x10 f vttsns vttref s5 1.5v s3 0.1 f c2 c1 r s5 r s3 10k 10k note: recommend connecting the thermal pad to the gnd for excellent power dissipation. s5 1 2 3 4 5 vddqsns vldoin pgnd vttsns vtt 10 9 8 7 6 gnd s3 vin msop-10 (fd) vttref G2997B top view thermal pad note: recommend connecting the thermal pad to the gnd for excellent power dissipation. s5 1 2 3 4 5 vddqsns vldoin pgnd vttsns vtt 10 9 8 7 6 gnd s3 vin msop-10 (fd) vttref G2997B top view thermal pad
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